PCB prototype

We understand how important it is to have the boards you ordered reach assembly ASAP. That's why we've made every effort to strengthen our core competencies, honing our manufacturing capabilities to ensure that we meet your order schedule in the shortest possible time.

Providing fastest board  turnaround solution
Layer Count	Fastest turnaround time	Order size
2-6 Layer	1-2 working days	up to 2000 sq-in
8-12 Layer	3 working days	up to 1500 sq-in
14-18 Layer	4 working days	up to 1000 sq-in
20 Layer Above	5 working days	up to 500 sq-in

 

We specialize in Quick turn PCB services with an industry leading turnaround time as fast as 72 hours.Not only do we know the importance of ensuring quick turnaround for the success of your project, but we also know that the resulting quality is equally as important. With our integrated in-house facility, 687-strong workforce, 87-plus dedicated engineer, 42 different PCB processing stations, and 24/5 production schedule, we can fulfill all PCB prototype projects on tight deadlines faster than the average lead times most PCB service companies can achieve - and with quality, of course. This means the shortest turnaround times and the highest quality for any HDI PCB project as well.

Our current production capacity, which is 80,000 sq-ft of high quality and reliable PCBs, can meet customers' requirements for single to 50-layer boards in the shortest possible time. At our facility, the more layers required, the lesser time we need compared to the average.

When your company needs fast and rapid PCB prototyping, know that you can count on Hemeixin to deliver high quality printed circuit boards on time at competitive prices.

We have an industry leading on-time percentage that customers have come to love. We understand the importance of delivering on our promises, so we have a rock solid customer satisfaction guarantee.

Quick turn PCB

Today’s OEMs are tasked with supplying higher performance products that require increasingly complex printed circuit boards (PCBs) while reducing cycle times and bringing products to market faster. This drives the need for quick turn PCB fabrication regardless of the complexity of the board, backed by advanced manufacturing processes and high mix production capabilities.

Hemeixin Electronics Co.,Ltd, through its Quick Turn Around (QTA) capability, provides a wide range of prototype/new product introduction PCBs in the early design phase so that customers can stabilize new designs and then get them to market quickly.
“Due to an increase in demand in the defense/aerospace, IT/supercomputer, medical and ATE markets, we have created a separate and dedicated QTA fabrication line with its own set of equipment, processes and operations personnel,” said PPC Manager, Director of QTA Operations at HemeixinPCB. “We have invested in QTA capability in order to provide 1 to 10 day turn around times, including those PCBs requiring complex technologies, high layer counts, high density interconnect and advanced manufacturing processes. Early successes include wins with new customers as well as new opportunities with existing customers.”
The attached photo shows an example of a fabricated QTA PCB. This is a 36 layer board with impedance control, gold surface finish, a 30:1 aspect ratio, depth controlled back drilling and pattern plating and was supplied in prototype quantities.
Once the prototype board is evaluated and approved by the customer, HemeixinPCB can seamlessly switch to production quantities, since its QTA line is a mirror image of the tools and processes employed in the standard fabrication line, which is widely recognized for producing outstanding PCB quality. In addition, the staff at HemeixinPCB can offer expertise in design for manufacturability and process optimization for improving yields and product reliability.

News Flexible circuit Bending

The reliability of flex circuits depends on careful design. Factors that can affect that reliability include:
•symmetry of design
•bend angle
•circuit thickness
•static vs. dynamic application
•choice of materials
•placement of features
•forming technique
•conductor routing
•discontinuities in the bend area

Careful planning and attention to these factors should produce a circuit that suits its application and delivers allthe benefits of flex circuitry at the lowest cost. When in doubt about how to best achieve specific goals in a flex circuit application, an experienced manufacturer can be invaluable in evaluating and balancing requirements,answering questions, and providing solutions.

A variety of factors can impact a circuit’s performance when flexed. These include:

•The closer the neutral bend axis falls to the center of the circuit’s material stack, the more evenly forces will be distributed among the other layers of the circuit when it is flexed

•Bend angle – the less a circuit is flexed, the smaller the risk of damage

•Thickness of the circuit – less thickness reduces the risk of damage when flexed

•Bend radius – a larger radius helps reduce the risk of damage

•Frequency of flexing – construction that might not be acceptable for a dynamic application, one in which the circuit will be flexed regularly, may be acceptable in a circuit designed to bend only once for installation

•Materials – proper selection of materials for their ability to accommodate flex and the way they transmit those forces to other layers in the bend area will improve performance

•Construction – designers should avoid placement in or near the bend area of features that are particularly vulnerable to forces generated in the bend area, or that can weaken surrounding circuit structure when flexed

Flex PCBs have been a key enabler of modern high density electronics, but achieving this density requires thinner layers and finer lines. Conventional three-layer flex circuits comprised of copper, polyimide, and bonding adhesives are giving way to thinner, smoother two-layer flex circuits that forego the adhesive layer – the copper is instead deposited directly on the polyimide. These two-layer circuits may be as thin as 30 µm, with line spacing as fine as 15 µm (0.6 mils). It’s imperative, therefore, that the processed panels are handled extremely carefully to avoid causing wrinkles, tension, or scratches.

Special design for manufacturing (DFM) software tools for flex circuits help neutralize production problems during the design stage. These advanced tools are used to fully automate manual editing sessions, reducing errors and critical cycle time. Among today’s available flex DFMs are automatic joint curving and surface smoothing, and automated coverlay and solder mask optimization that make design faster, higher quality, and more accurate.

its eliminate these joints, making them much more reliable and able to deliver overall higher product quality and longevity. So while rigid-flex PCB technology is certainly not new, various considerations now make it much more viable – not the least of which is cost.

Thermally Conductive PCB

Hemeixinpcb, a thermal management technology company, announced its new MCPCB product, Copper Via embedded Aluminum Core PCB. This highly thermal conductive MCPCB is comprised of a regular aluminum core PCB and a specially embedded Copper Via that effectively draws the heat from the elements bonded on the top surface and distributes it to the aluminum core of the MCPCB. This innovation enables circuit engineers to have much less thermal restriction in circuit design and it offers more flexibility in components selection This unique and cost effective process developed by Cofan USA to embed Copper Via onto the Aluminum Core is completely contamination-free, and it makes it possible to integrate into conventional Aluminum Core PCB manufacturing processes. As a result, the MCPCB’s thermal conductivity is further enhanced through the Copper Vias, with no increase in cost. The cost is the same as an Aluminum Core PCBs which is relatively much lower than that of Copper Vias on Copper Core PCB. This Copper Via embedded Aluminum Core PCB is currently available for order, and ready for market consumption as with the conventional MCPCB with Copper Vias on Copper Core.

    When the copper metal pricing went higher and higher, use small pieces of metal to solve the thermal dissipation problem become important. Locally bond the metal coin by bonding film or sweat bonding is one solution. Plug the metal inside the PCB is another. One advantage for this process is the metal can be fit into the multiplayer construction during lamination process. The coin grounding can be done by drill through hole or use sweat bonding.


      For the double side PCB, plug the metal in PCB is also possible. It can be done by a process similar to hole plugging which we fill the epoxy resin in the slit between PCB and metal coin. However, the metal thickness need to by the closeto the PCB. Usually designer will ask the metal coin should be very flat at least on one side. The quality control need to be careful.

    Similar insertion design can be done by sweat bonding process. It is still in concept stage. But I think it can be done, too. It's a post bond process. One advantage is that only PCB pass the QA process will go to bonding procedure. Please see my article "Sweat solder bonding technology for metal PCB".
If the PCB is mutilayer,  and it needs to ground one of the layer to the metal coin, use electrically conductive paste is one solution. The slot needs to be edge plated first. The the conductive paste fill in before outter layer processing.  The conductive paste area on top layer can covered with solder mask to avoid any kind of circuit short.
    One advantage of coin insertion PCB is the light weight and easier assemble. For a metal bonded PCB, before the PCB assembly, a long time preheat is necessary. Cooling time is also longer for its high thermal capacity. For copper insertion PCB, if the coin size is small compare to whole PCB, the PCB assembly is almost not be affected. Compare to locally bonded coin, the flat structure can eliminate the using of special fixture.
8. High power LED substrate
    For a packed LED component, aluminum based IMS design is widely used in the industry (see Fig 5). The heat transfer from component go through a high thermal conductivity (no less than 1 W/m-k) material to aluminum plate. The thickness of the dilectric material needs to be select carefully. The thiner dielectric which have lower thermal resistance may cause dielectric breakdown problem.

    The LED chip can put directly on a LED substrate with cup design and copper backing to reduce cost and resolve heat problem. The quality of LED chip maybe a problem needs to be concerned. The cup usually designed with an optimum angle and plated with silver to get better reflectivity. The bonindg pad need to be plated with bondable metal like thick gold, silver or Ni/Pd/Au.

Boardtek also owned a patent which use a plastc or metal pre-formed cup to replace the cup that need to be machined in PCB. It can save a lot of cost and have better light performance.

Heavy copper circuits

Various power electronics products are being designed every day for a range of applications. Increasingly, these projects are taking advantage of a growing trend in the printed circuit board industry: heavy copper and extreme copper printed circuit boards.

What defines a heavy copper circuit? Most commercially available PCBs are manufactured for low-voltage/low-power applications, with copper traces/planes made up of copper weights ranging from 1/2oz/ft 2 to 3oz/ft 2. A heavy copper circuit is manufactured with copper weights anywhere from 4oz/ft 2 to 20oz/ft 2. Copper weights higher than 20oz/ft 2, and up to 200oz/ft 2 are also possible and are referred to as extreme copper. For our discussion here, we will focus primarily on heavy copper. The increased copper weight, combined with a suitable substrate and thicker plating in the through holes, can transform the once unreliable, weak circuit board into a durable and reliable wiring platform.
It's probably no one really need fine line with heavy copper like 5 oz thick. If it is real, can we make it? Well, I did not specify the trace space. If no space issue and the definition of the trace width is to measuer its bottom side, then what will be the width of this 5 mil wide trace on its top side? For a etching factor of 2, the width will be zero. It means the 5 mil wide pattern will not able to created by standard etching process. So, how do I make this happen?
 I invented a process to make thick copper by electroplating process. The purpose of the process is making heavy copper and thin copper on the same layer. Use the same way, we can make 5 oz copper trace with width of 5 mil. In fact, the more stringent criteria like 8 oz thick with 5 mil wide will probably OK. Since 8 oz copper is more than 11 mil thick, the trace aspect raio is bigger than 2!
So, how do I make it? We can start with 6 mil thick single side laminate with 1 oz copper clad. Cover the claded copper by photoresist or tape. Then, use laser to cut the circuits pattern from its no clading side with width of 5 mil (you can image that 4 mil or thinner is also possible). The laser cutting needs to cut into the copper foil on the opposite side so that the copper can be exposed. The claded copper is usually not damaged by laser if it is under control. The space between 2 traces can be 5 mil or higher, depend on how serious you have to concern on CAF issue. A desmear process is needed if you use CO2 laser. It can remove any resin residue on the bottom of the copper. Then, we can put it into the plating tank for copper plating. This is just like a pattern plating process used in PCB with very thick plating resisit. The plated copper will fill the laser cut groove, or circuit pattern, after enough plating time. In this case, the plated copper thickness is roughly 6 mil. We can use this plated laminate, after remove the photoresist, as an inner layer or outer layer core. After lamination with other circuits, the plated core can be etched from top side with copper foil clading. Together with the plated copper, the 1 oz copper foil plus 6 mil can have the total copper thickness over 5 oz. 
Like the previuos article, the etching can make the board having thinner copper when this etching process does not on the plating area. So, the thick and thin copper can be done on the same layer. Since most of the heavy copper is buried into laminate, the this and thick copper is on the same level without worry its height difference. And, since the heavy copper buried into core, we don't need to worry the peel strength of this thick trace even it has finer line.

PCB Assembly and PCB Fabrication

If you prototype printed circuit boards in the China., how can you ensure that laminates and prepregs you used will match those used in offshore volume production?

As an industry, those of us involved in designing and manufacturing electronic products can all agree that we now live and operate in a global supply chain environment. Since a lot of what is incorporated into current and next generation products is reflected in the software, this isn't much of a concern. Take your favorite products, download the latest software update and newly developed apps and you're ready to go.
When it comes to developing the pieces of hardware, the process is not so simple. And, when it comes to printed circuit board (PCB) development efforts, the process becomes even more challenging. That's because PCBs are the launching points for hardware product development and the laminate and prepreg materials used in designing and manufacturing PCBs are the nuclei for those boards. (Prepreg is fiberglass cloth that has been saturated with resin that is not fully cured. As a PCB is placed under the heat and pressure of lamination this resin melts and flows into the voids in the adjacent copper layers filling them.)
Semiconductor chip technology has become so advanced that testing these highly complex devices must be performed effectively to ensure high reliability and functionality. This allows chipmakers to convey to their OEM customers their highest confidences that their products are of the foremost quality and have been verified to operate according to their specifications.
An automatic test equipment printed circuit board, or ATE PCB -- serving as an interface to a large test system -- is at the heart of all major test activities to verify a specific chip's functionality.
This assures chipmakers their semiconductor products are good-to-go to an ever- burgeoning chip market led by newcomers, such as Internet of Things (IoT), wearables, handheld devices, and other similar products.
ATE PCBs are designed and assembled to test an array of different semiconductor chips, including microprocessors (µPs), memory, system-on-a-chip (SoC), field-programmable gate arrays (FPGAs), and others. However, an ATE PCB is designed and assembled specifically to test one particular kind of chip set. Some of today's highly advanced chips bring tens of millions of dollars into a chipmaker's coffers.
In order to achieve that highly-prized chip-testing quality for chipmakers, a group of experienced program and project managers and highly-trained and savvy engineering personnel in ATE PCB assembly are of paramount importance. The requirements for disciplined administration management and assembly line technical knowhow are above and beyond that required for conventional PCB assembly. Considerable monetary loss and lost time-to-market are incurred if there's a misstep along the way toward successful assembly completion of an ATE PCB.

Quick turn prototype assembly

HemeixinPCB provide quick-turn prototype, low-volume and production PCB assembly with surface-mount (SMT), through-hole (THT) and mix components. We offer turn-key (just send us the Gerber and BOM files), consignment (you supply all parts) and various components purchase options to help you reduce cost and wait time.

• Less than 0.05% return rate on all PCBs manufactured
• Our 100% guarantee on manufacturing defects
• Optional Engineering Review to analyze and report on any manufacturability issues with your design as submitted
• Flying-Probe Electrical Test: comparing your PCBs electrically to your submitted Gerber files
• Self-service DFM checking with our online DFMplus service
• PCB circuit board assembly in as little as 24 hours
• As few as one board
• Full RoHS compliance available
• Easy and complete online quote and order process
• Kitted or turn-key processing available
• Machine placement of parts from 0201 passives to high-pin BGAs
• IPC-A-610 Class III and TS16949 available

Our quick-turn prototyping service can assemble your boards within 24 hours. We can handle small quantity as well as volume productions. All our services are at a very competitive price and with 100% satisfaction guarantee.